工作內容
1.Optimization of PC commercial business development including key account management and bid desk system operation
2.Good at territory or country vertical channel development and key account management.
3.Familiar with bid desk mechanism built-up between HQ, region, country, cross BUs and FU.
4.Familiar with global commercial business operation and demand-supply fulfillment management in ITC industry 

工作內容

[工作內容]
 Proficient at acoustic design. (Acoustic Electronics, and Mechanics)
 Proficient at audio and voice tuning.(EQ, 3GPP, HD-Voice, DSP Audio)
 Proficient at audio circuit.
 Support factory on-site for production.
 Knowledge or ability on acoustic simulation is plus.

[工作能力需求]
 Fluent English.
 5+ years experience in acoustic design of products.

 

Responsibilities:

• Product hardware development and integrate, schematics design, layout review, BOM maintenance, functionality verification, reliability testing, production testing planning, and failure analysis  
  • Class-D audio amplifier 
  • HDMI/DisplayPort extenders
• Co-work with teams, PM/ID/ME/Layout/FW/SW/QA/etc. 

• 5Yrs+ experiences in audio amplifier and video products (TV STB/Smart TV/Smart Speaker)  
• Strong knowledge and experiences in signal integrality, noise isolation, noise reduction, and familiar with audio PWM, HDMI, DP interfaces, and related test equipments 
• Good at English reading/writing/listening/speaking
• Familiar with multimedia SoC platforms, e.g. Qualcomm/Synaptic/MediaTek/Realtek/etc.

R&R:
- Hardware circuit design, PCB layout review, design verification testing. BOM maintenance, production and RMA failure analysis 
- Survey and evaluate new solutions/platforms
- Involved product life phase from NPI, MP, to EOL
- Co-work with function teams, PCB layout, component engineering, firmware, mechanical engineering, electrical power engineering, thermal engineering, QA, software engineering, project management, ID, compliance engineering, etc.  

Qualification:
- At least 8 years of system hardware design
- 400Gbps/100Gbps/40Gbps/10Gbps serdes, PCIE gen3/4, SATA, high speed interface design experience
- Experience with ESD, Surge, safety, compliance regulations
- DC/DC power circuit design 
- Familiar with hardware EDA tools, ORCAD Capture CIS, Cadence ORCAD Layout, Cadence Allegro, Mentor PADS

工作條件
1. Responsible for BIOS server project and co-work with other function team for motherboard porting.
2. Develop x86 BIOS feature, including RAS, redfish, IPMI, … etc, according to customer request.
3. Coordinate with EE/vendor to narrow down problems, provide root cause, and patch for BIOS issues.
4. Study and develop new technical knowledge, participate BIOS design, and write related guide.

具備條件

經驗與背景要求                        
1.產業經驗: a.製造業                        
                     b.資訊業                          
2.專業背景: a.跨地區企業級系統架構設計經驗           
                     b.了解企業級網路與系統硬體架構            
                     c.分散式大數據架構規劃能力                      
3.核心能力: a.IT系統與數據整合與規劃能力               
                     b.熟悉IT軟硬體底層運作機制與整合      
                     c.系統化分析與解決問題能力                      
4.主管經驗: a.團隊管理3年以上經驗                                                                   
5. 人格特質:a.負責任                        
                     b.善溝通協調                          
                     c.規劃能力佳                           
6. 語言能力:a.英文能力聽說讀寫佳                                                

 臺資科技上市公司
 薪資優渥，福利良好
【工作內容】
 1. 產品系統與互聯網資訊應用服務，領導團隊進行軟體專案開發、測試、驗證與上線
 2. 了解市場需求，思考合適之解決方案，協助產品之發展與應用
 3. 團隊領導與跨部門溝通協調
【工作能力需求】 
1. 擅長工具：Java, JavaScript, Python and SQL
 2. 具備團隊合作經驗與專案管理能力 
3. 勇於挑戰，具創新思考與商品化思維

Product ：consumer electronic Video/Audio solutions
Description：

• Firmware development on Microcontroller platforms with respect to functionality, performance and quality.
• Design, implementation, and verification of EE/FW components required for new product concepts, prototype, and product development
• Develop and integrate test frameworks into existing firmware and BSP
• System level debugging, efforts to improve performance and reliability.
• Support FW development tools, source code revision, configuration, and release management tools.
• Write technical specifications, perform end-to-end integration, root cause, and resolve system-level performance and reliability issues.

• 7+ years of proficiency in MCU firmware Coding
• Proficient in reading basic schematics and layouts
• Experience in working with Microprocessors/Controllers (STM, NXP, Cypress, Dialog, Ti, NVDIA) .
• Good Understanding of Audio/Video Technologies would be a plus.
• Experience working with multi-core processors shared memory and peripheral control.
• Good understanding of GPIO, peripherals, I2C, SPI, UART, USB, DMA connected devices
• Solid programming experience in C or C++ .
• Some scripting languages expertise in Python is preferred
• Extensive debugging skills, should have used JTAG, debuggers, USB analyzers
• Ability to mentor and lead junior level engineers in design and implementation. 
• Experience in using Source Control / Project Tracking systems (Github, Jira)
• Experience in USB protocol, Bluetooth or any Wireless protocol would be a plus.
• Hands-on experience in operating system such as Windows, Linux, RTOS

Responsibilities 

• Collaborate with other professionals to determine functional and non-functional requirements for software or applications. 
• Providing the engineers with architectural blueprints to follow. 
• Guiding and assisting the development team throughout the process. 
• Provide technical guidance and coaching to engineers. 
• Ensure software security and actively monitor the sharing of private information. 
• Looking for problems within software systems and resolving the issues. 
• Locating and directing solutions for critical challenges. 

具體條件
• 6+ years of experience designing system architecture and implementing software applications. 
• Familiar with common programming languages such as JavaScript/TypeScript, python 
• Experience working on cloud and hybrid-cloud software services. 
• Experience working on database systems including PostgreSQL, MongoDB and Redis. 
• Experience working on platforms including Kubernetes, Rancher and more. 
• Extensive experience in software development and project management. 
• Strong soft skills, including attention to detail, problem-solving and communication skills. 
• Clear logic thinking and good presentation skills. 

Responsibilities:
• Conduct cutting-edge research and development in CV, ASR, NLP, Machine Learning and other related fields.
• Work closely with partners and engineers to create or improve algorithm/model performance and transfer advanced technologies to products.
• Author quality and peer-reviewed publications.

 

Responsibilities

• Mainly focus on packaging design until mass production.
• Create packaging drawing / structure / concept.
• Develop new material / finish / process / UX improvement.
• Sample / DFM / SOP review.
• Internal - Work closely with the ID / ME / PM / Graphic team.
• External - Work closely with CMs / Suppliers.

• Logical thinking / Proactive personality.
• Effective communication and time management skills.
• 3+ years of experience in development of packaging structure design.
• Experienced using 2D: AutoCAD / Illustrator.
• Experienced using 3D: Rhino or Solidworks or ProE / Keyshot.
• Knowledge of material processing for pulp tray, cardboard, blister, gift box, carton and all types of printing processes.
• Knowledge of a wide variety of packaging styles, type and material.
• Knowledge of reliability tests.

1. Mechanical Design
2. Project Management
3. Issue Analysis and Solution Capability
4. Cross Function Communication

工作職掌:
1. CAD 設計3D/2D by UG
2. Design review and analysis
3. DFM review and discussion with vendor
4. Design improvement proposal
5. DOE planning and report
6. Tracking and FA for PD issue of NPI build

專業相關: 
1.有Server產品ODM/品牌廠機構設計經驗3年以上。(一面前需附上個人作品集)
2.熟悉6-sigma,GD&T,公差分析概念，熟悉UG繪圖軟體與JMP分析軟體佳。
3.熟悉機械加工工藝與DFMreview.對於鈑金、射出成形、CNC、金屬表面處理等知識。
4.英文聽說讀寫能力順暢，可以獨立與美系客戶溝通及合作。
5.習慣團隊工作模式、擅長溝通以及能夠有效快速的傳授知識技能與新進人員。


 

Job Responsibilities 
-         Conduct mechanical feasibility study from initial ID concepts through sizing analysis, component selection, refinement of design details, assembly and integration, and performance/environment qualification testing 
-         Search out materials, components. Create detailed 3D CAD models, 2D drawing and BOM for the product. 
-         Perform thermal, structural testing and analysis to predict and optimize the system performance 
-         Build prototypes, analyze results of reliability testing, improve the design and bring to production. 
-         Develop component and assembly drawings and specifications, tolerances for production 
-         With EV-charger product design/MP experiences. Can lead from ID structure to Mass production. 
-         With a good thermal sense and can apply thermal solutions in the initial stage. And co-work with the thermal team to optimize design. 
-         Familiar high tension distributor design (cable route in EV-charger DC) 
-         Familiar safety and reliability of Ev-charger. 
-         With Outdoor IPX6 product design/MP experiences, familiar test and verification in MP. 
 

工作內容：
1. 規劃軟體架構，評估 ROI，執行控管軟體開發，深化 BU 產品的附加優勢
    a. 規劃與執行 解決方案 (Market Ready Solution)
    b. 規劃與執行 IoT edge device 的跨平臺的軟體框架，並導入到產品
    c. 規劃與執行 雲服務 (SaaS)，並導入到客戶方案
2. 分析客戶需求，控管軟體規格，評估時程與投入資源，確保軟體開案 ROI
3. 制定與迭代  軟體細節規格，包含 solution, Middleware (Utility, API, services), cloud services
4. 與策略 雲服務夥伴 (Cloud Service Provider)，研擬合作方案，深化合作關系
5. 評估 ISV (Independent Software Vendor) 與 AI 技術廠商，提升合作層次，擴大生態圈夥伴
6. 軟體專案管理，計畫排定任務的優先順序，確保交付時程與軟體品質

具備條件

工作內容
Product Roadmap & Portfolio ownership
1.     Market trend and Competitor analysis
2.     Product features definition
3.     Push for Time to Market in technology/architecture transition
4.     Identify product roadmaps gaps and engage with WW development teams to deliver roadmap requirements
5.     Support product pitch, demos and training to markets / partners

工作內容
1.由「BU」的角度思考，做好縱向與橫向單位間溝通，爭取資源、制訂前瞻策略與發展團隊於長遠規劃上。
2.協調分配資源，根據組織的需求變化快速調整人力及協調各種資源，確保關鍵資源最佳化，重要目標的進度符合預期。
3.承上啟下，將BU目標轉換成部門目標，規劃部門短、中、長期發展，讓同仁清楚明確的目標方向和量化的里程碑，並規劃可執行的方案
管理部門運作，建立統一的營運管理方針政策，對部門日常進行指導、指揮、監督、管理，並承擔執行各項上級指示的任務
4.瞭解組織內的工作項目與流程，體會工作細節的效率。讓同仁共同將瑣碎的事情透過建立SOP和系統化...等有效的方法管理，提升整體的營運效率
5.創新產品和商務模式，顛覆產業，創造客戶價值
6.挖掘商務合作和業務機會。

具備條件
產品線/區域：機器人、智慧教育、智慧醫療
其他條件
- 物聯網、人工智慧應用、機器人、教育類創新產品...等產品
- 電子業、軟硬體整合商、創投
- BD、PM、商務策略管理顧問
- 主管10年以上經驗

 

職缺條件
1. 具8-10年以上經驗電子產品開發專案管理
2. 具3年以上伺服器產品開發經驗
3. 具3年以上團隊領導經驗

 

工作內容：
1. SMT
2. 新產品導入
3. PCBA
崗位職責：
1. 負責對公司SMT產品的技術研發和投資方案的制定;
2. 負責分析市場動態，提出SMT產品技術發展趨勢;
3. 制定並管理SMT產品的研發計劃，監督計劃實施;
4. 根據市場需求和客戶需求，優化產品結構，提供有效的產品方案;
5. 負責技術裝備的投資安排，確保設備的正常維護和管理;
6. 組織SMT產品的質量檢測，並監督生產品質的管理;
7. 負責協調資源，確保SMT產品的正常研發、生產和品質控制;
8. 按照公司要求完成其他相關任務; 
任職要求：
1. 工作經驗：12年+ PCBA行業工程DFM/DFA相關工作經驗
2. 管理經驗：5年+專案專案執行管理或生產統籌經驗
3. 工作技能：
• 10年+ SMA DFM相關製程管理及異常處理經驗，熟練使用Minitab，DOE，SPC，FEMA，6 Sigma等製程分析工具
• 5年+新產品新製程/新技術導入經驗或自動化設備開發驗證經驗
• 有新產品小量試做 到大量生產經驗
• 個人特質：有企圖心、責任感、上進心、邏輯思維能力強，具有創新意識及良好的溝通協調能力
• 英語能力：聽/說/讀/寫流利

管理職

工作職掌：
1.設備採購團隊管理
2.採購商務談判及成本分析
3.Cost saving及提升服務水平
4.供應商開發管理

基本條件需求：
1.熟悉採購作業流程，設備廠商資源豐富
2.採購談判、降本技巧、分析判斷力強
3.團隊管理及跨部門協作溝通能力強
4.英語口語表達流利

基本條件需求：採購供應鏈/工程/國際貿易/機電優先
 

工作職掌：
1.主動元件採購降低總成本，側重在 EV採購
2.關鍵物料包產能與保供應、Early   project involement
3.BOM結構優化、成本分析管理
4.供應商開發及管理


 

管理職

工作職掌
1.電池材料與設備採購策略制定與執行
2.優化BOM結構、推薦2nd source及 Cost Saving
3.關鍵物料包產能與保供應
4.供應商開發及管理、季度績效檢討

需具備專業：
1.熟悉電池材料與設備採購作業流程
2.具備新能源電池產業相關經驗
3.具管理經驗(至少帶領過5-10人的團隊)
4.責任心強，善於溝通協調，英語流利

基本條件需求
採購供應鏈/工程/國際貿易/機電優先

工作內容：
 1.策略採購(sourcing)
　　1.1 負責EV充電樁材料項目。
　　1.2 詢比議價, , 專案BOM cost審查, 相關內部資料維護。
　　1.3 執行供應商管理, 執行採購策略, 掌握供應鏈市場訊息。
　　1.4 對接研發部門, 新規選型, 材料成本優化…..等相關前期採購作業。
 
2.供應商管理與開發
　　2.1 強化關鍵供應商策略合作關係, 定期business review。
　　2.2 持續開發具競爭力供應商, 供應鏈汰弱留強。


3.其他事務
　　3.1 集團內跨廠區、跨部門協同合作。

 

R&R:
1. Execute budget/actual financial performance review (incl. MoM, YoY) on P&L, CapEx, and related key drivers 
2. Provide management reporting with business insights, including potential opportunities to improve profitability and early warnings on future deviations.
3. Act as a business partner with customer PBUs / functional platforms to drive initiatives and recommend changes for process improvements.
4.  Work on new business development assessment through early involvement and proactive engagement as well as cross-functional team collaboration
5. Act as an FP&A representative to various high priority projects to ensure financial soundness
6. Take in-charge for Ad-Hoc analysis
 

 

公司性質：台灣知名上市大集團
工作內容： 
   1. 合約風險把關 
   2. 法務工作領導及團隊管理
   3. 跨國及跨單位事務溝通及協調 
   4. 總部角度出發之各區工作協作
   5. 專案指導及/或主導，專案含法遵、訴訟、勞資爭議等
   6. 主管指派事務協作及/或處理 
 

公司性質：上市電子科技業 
工作內容： 
1.公司銀行額度管理與維繫 
2.公司及海外子公司資金調度與外匯避險 
3.上市櫃公司財務資訊公告及財務相關工作經驗 
4.聯貸及公司資金籌措規劃