(1)擬定產品和業務進攻策略，提出結合華碩強項的未來發展藍圖
(2)掌握及分析市場走向及技術發展趨勢，結合BU營運目標與策略，提前佈局
(3)研析目標產業之國內外企業動態，持續擴展多元商業機會
 

1. Define and oversee the worldwide digital marketing strategy, covering all digital touch points including ASUS websites, ASUS ecommerce sites, social media, online advertising, email marketing and etc. 
2. Lead and manage the Digital Marketing Manager and team, ensuring strategic alignment and professional growth across global digital marketing operations. Lead, manage and develop the digital marketing team in the execution of key campaigns, effective digital media plan that optimize global and local product launches, campaign, web pages, user funnels to maximize the awareness and conversion.
3. Direct paid media buying and optimization, responsible for budget allocation and ensuring strong effective resource utilization across digital channels, such as Meta, Google, X, LinkedIn, TikTok, etc. Explore new media buying tools to increase traffic to ASUS marketing channels. 
4. Lead the team for e-tailer and ecommerce content strategy and execution, ensuring product pages, digital assets, and campaigns are optimized globally. Driving product visibility, discoverability, and conversion on etailer platforms to maximize online sales performance.
5. Enable AI and new digital marketing tools. Stay current with emerging trends and best practices in AI and digital marketing, applying relevant innovations to projects. Develop SOPs , provide training and share digital marketing best practices with global and regional teams
6. Set and monitor measurable goals on various KPIs and business outcomes, leveraging analytics and insights to optimize overall digital performance and inform executive decision-making.
7. Collaborate with global stakeholders and executives, aligning digital initiatives with brand positioning, product launches, and long-term business objectives.


1. 8+ years of digital marketing experience including at least 2 years in a senior leadership role.
2. Strong expertise in AI-driven marketing, digital platforms and analytic tools, such as Google Analytic / GA4, SEO( SEMRush, Ahrefs , Google search console) , media buy (Facebook Ads, Google Ads tools), email/CRM automation, BI tools etc. 
3. Have solid experience and proven success in managing high-scale digital performance marketing campaigns or programs.
4. Track record of leading cross-functional projects with a results-oriented mindset and problem-solving ability.
5. Proven ability to manage multiple projects simultaneously, delivering results under tight timelines
6. High emotional intelligence, strong interpersonal communication skills, and a strong sense of accountability in managing digital media projects.
7. Bachelor’s degree in Marketing, Business, Computer Science, Information Technology, or related field

職務
負責機器人／Physical AI 產品與解決方案之國內外 B2B 商務拓展，以美國市場為重點，帶領業務團隊開發關鍵客戶與策略夥伴，並協同海外據點及關係企業制定市場策略，推動營收與毛利成長。
1. 市場策略與業務開發
-制定台灣、美國及其他重點海外市場之 Go-to-Market、客戶分群、通路與成長策略。
-開發大型企業、醫療體系、SI、通路及 OEM/ODM 等策略客戶與夥伴，建立高品質 Sales Pipeline。
-辨識新市場、新應用場景與商業模式，推動 PoC、Design-in、方案合作及商業化落地。

2. 業務團隊領導
-帶領現有業務團隊開拓國內外市場，依成員能力進行目標設定、分工、Coaching、Deal Review 與績效管理。
-建立一致的銷售流程、Pipeline、Forecast 與客戶管理機制，提升團隊整體成交能力與業績表現。

3. 美國據點與跨公司商務協同
-作為總部與美國據點之主要商務協作窗口，協調市場策略、重大客戶、Pipeline、Pricing 與 Forecast。
-對接關係企業／併購公司之業務團隊，共同制定 Go-to-Market、Key Account、Cross-selling 與合作策略。

4. 關鍵客戶與重大商務談判
-經營關鍵客戶與高階決策者關係，主導重大提案、商務模式、價格、合約及策略合作談判。
-協同產品、研發、FAE、製造、供應鏈、財務及法務，形成具競爭力且可執行的解決方案。

5. 營運與成果管理
-對年度營收、毛利、Pipeline 品質與 Forecast 準確度負責。
-定期檢視重大商機、競爭態勢與資源配置，將市場與客戶洞察回饋產品 Roadmap 與公司策略。

1. 必備條件（Must-have Qualifications）
• 8–12 年以上 B2B Business Development、Strategic Sales、Key Account 或 Solution Sales 經驗，具大型／複雜專案開發實績。
• 具機器人、自動化、AI／Physical AI、智慧製造、醫療科技、企業級硬體或相關深科技產業經驗者佳。
• 能獨立從 0→1 開發新市場與策略客戶，熟悉長銷售週期、多方決策者及跨國商務流程。
• 具 Executive-level 溝通、策略簡報、商業提案與價值型銷售能力，能將技術能力轉化為客戶商業價值。
• 具價格策略、商業模式設計、合約條款與重大商務談判能力，具營收與毛利意識。
• 熟悉 Pipeline／CRM 管理、Forecast、Account Planning 與商機評估方法。
• 優異跨部門整合能力，能協同產品、研發、技術、製造、供應鏈、財務與法務推進複雜合作。
• 商務英文近母語或高度流利，可獨立進行跨國會議、簡報、談判與書面溝通；可配合海外出差。

2. 加分條件（Preferred Qualifications）
• 具 Design-in、PoC-to-Production、系統整合或平台生態系合作經驗。
• 具北美、歐洲、日本或亞太市場之客戶／夥伴開發經驗。
• 曾建立新事業、新區域或新垂直市場之 GTM 與商業化機制。
• 具團隊帶領、Mentoring 或跨功能專案領導經驗。
• 具備醫療器材法規／採購流程認知

3. 個人特質（Personality Traits）
• 強烈 Ownership 與 Results-driven，能對商務成果與長期客戶價值負責。
• 高度商業敏感度與策略思考，能在資訊不完整與高度不確定情境下做判斷。
• 兼具獵人型開發動能與顧問式／夥伴式溝通能力。
• 抗壓、韌性高，能處理多商機並行、長週期談判與跨文化協作。
• 誠信、成熟、可信賴，能代表公司面對高階客戶與外部合作夥伴。

1. Develop/ implement GC/ South East Asia-focused content strategies/plans for community activations aligned with all business objectives
2. Provide qualitative and quantitative analysis to the team based on social reporting/ media listening tools
3. Adapt global strategies to fit local contexts, tailoring ASUS’s messaging to meet the unique needs and trends of Chinese-speaking markets
4. Build community connections by collaborating with partners, agencies, or influencers to amplify ASUS’s presence and deepen engagement
5. Collaborate effectively with international teams to ensure alignment with global initiatives while adapting content for the specific needs of the Chinese-speaking markets
6. Partner effectively with cross-functional teams to ensure alignment
7. Continuously monitor market trends, competitors' activities, and customer behaviors to stay ahead of opportunities and challenges

1. At least 6 years’ experience in digital marketing or communications. International PR or digital agency experience is an advantage
2. Ability to work effectively in a highly matrixed organization
3. Proven skill and experience with written communication and editing
4. Knowledge of AP style and/or AP business style
5. Strong knowledge and experience using social media and other digital outlets to support content distribution strategies
6. Proactive, creative, and highly organized, with a passion for connecting with diverse communities
7. Strong understanding of Chinese-speaking communities and their cultural dynamics
8. Experience living or working in Singapore, Malaysia, Hong Kong, or mainland China is a plus, bringing valuable regional insights

工作內容
1.Optimization of PC commercial business development including key account management and bid desk system operation
2.Good at territory or country vertical channel development and key account management.
3.Familiar with bid desk mechanism built-up between HQ, region, country, cross BUs and FU.
4.Familiar with global commercial business operation and demand-supply fulfillment management in ITC industry 

• Key Responsibilities
1. Industry & Technology Trend Monitoring
• Monitor semiconductor industry roadmaps to understand silicon process trends and ensure system-level readiness.
• Collaborate with silicon vendors to evaluate and influence CPU, XPU, and AI ASIC architectures for future datacenter deployments.
2. Technical Evaluation & Product Planning
• Analyze and compare emerging processor technologies across vendors, assessing performance, power, and cost trade-offs.
• Lead internal technical planning and feasibility studies for integrating advanced silicon into Wiwynn’s product portfolio.
• Support cross-functional teams in aligning product development with future silicon capabilities.
3. External Engagement & Strategy Translation
• Represent Wiwynn in industry forums and technical working groups related to CPU and ASIC development.
• Translate market and technology insights into strategic recommendations for product direction.
4. Internal Collaboration & Mentorship
• Provide technical mentorship and guidance to junior engineers in the domain of processor and ASIC technologies.

Qualifications
Education:
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
Experience:
• 8+ years of experience in CPU, XPU, or ASIC architecture, design, or system integration.
• Strong understanding of semiconductor process technologies and industry trends.
• Experience in technical marketing or product planning at IC design houses is a strong plus.
• Proven ability to evaluate and compare chip architectures and market positioning.
Skills:
• Familiarity with datacenter workloads and CSP infrastructure requirements.
• Excellent communication and cross-functional collaboration skills.
• Strategic thinking and ability to translate technology trends into actionable plans.

• Candidates with prior experience in technical marketing at IC design houses are highly preferred. The ideal candidate should be capable of comparing different chip architectures, understanding market dynamics, and identifying technology trends that influence datacenter infrastructure.

The division lead of hardware engineering leads the end-to-end strategy, design, and delivery of enterprise and hyperscale server hardware solutions. Drive innovation while ensuring design excellence and quality

Key Responsibilities
1. Hardware Engineering Team Management
• Lead the core Hardware Engineering team responsible for server board-level and system-level design.
• Drive design reviews and coordinate with specialist teams (Power, SI/PI, Mechanical/Thermal, Validation) to ensure architecture alignment and design quality.
• Establish development processes, engineering standards, and documentation practices for consistent execution across projects.
• Coordinate and allocate hardware engineering resources for different projects requirement.
2. Accountable on Projects Development 
• Accountable on projects development and cross functional activities.
• Support mass production engineering activities.
3. Engineering Support to Manufacture Sites 
• Provide engineering support to manufacturing sites, ensuring seamless integration between design and production
4. Customer Relationship Management 
• Maintain strong relationships with customer HW Engineers and the manager, addressing inquiries with timely, constructive responses and recommendations.
• Present and discuss Wiwynn’s products, architectures, and technologies with customers.

Qualifications
Education: 
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
Experience: 
• 12+ years in server hardware design and development, with at least 5 years in a leadership role managing large, multi-disciplinary teams.
• Minimum of 3 years as an Engineering Director or 5+ years as an Engineering Senior Manager, managing teams of 20+ engineers.

Competencies:
• Deep knowledge of server architecture, high-speed signal integrity, power delivery and system integration.
• Strong understanding of industry standards (PCIe, DDR, NVMe, OCP) and emerging technologies.
• Expertise in program management and operational execution for complex hardware projects. 
• Proven ability to lead teams in driving vendor solutions and ensuring timely issue resolution.  
Language Skills:
• Proficiency in English and Mandarin, both written and verbal, for effective cross-site collaboration.
Leadership & Collaboration:
• Strong influencing, communication, and stakeholder management skills. 
• Skilled in strategic planning, decision-making, and fostering a culture of innovation and accountability.
Personal Attributes:
• Strategic thinker with strong analytical and problem-solving skills.
• High adaptability and resilience in a fast-paced, competitive environment.
• Excellent communication and negotiation skills; proactive and results-oriented mindset

工作內容

[工作內容]
 Proficient at acoustic design. (Acoustic Electronics, and Mechanics)
 Proficient at audio and voice tuning.(EQ, 3GPP, HD-Voice, DSP Audio)
 Proficient at audio circuit.
 Support factory on-site for production.
 Knowledge or ability on acoustic simulation is plus.

[工作能力需求]
 Fluent English.
 5+ years experience in acoustic design of products.

 

Responsibilities:

• Product hardware development and integrate, schematics design, layout review, BOM maintenance, functionality verification, reliability testing, production testing planning, and failure analysis  
  • Class-D audio amplifier 
  • HDMI/DisplayPort extenders
• Co-work with teams, PM/ID/ME/Layout/FW/SW/QA/etc. 

• 5Yrs+ experiences in audio amplifier and video products (TV STB/Smart TV/Smart Speaker)  
• Strong knowledge and experiences in signal integrality, noise isolation, noise reduction, and familiar with audio PWM, HDMI, DP interfaces, and related test equipments 
• Good at English reading/writing/listening/speaking
• Familiar with multimedia SoC platforms, e.g. Qualcomm/Synaptic/MediaTek/Realtek/etc.

R&R:
- Hardware circuit design, PCB layout review, design verification testing. BOM maintenance, production and RMA failure analysis 
- Survey and evaluate new solutions/platforms
- Involved product life phase from NPI, MP, to EOL
- Co-work with function teams, PCB layout, component engineering, firmware, mechanical engineering, electrical power engineering, thermal engineering, QA, software engineering, project management, ID, compliance engineering, etc.  

Qualification:
- At least 8 years of system hardware design
- 400Gbps/100Gbps/40Gbps/10Gbps serdes, PCIE gen3/4, SATA, high speed interface design experience
- Experience with ESD, Surge, safety, compliance regulations
- DC/DC power circuit design 
- Familiar with hardware EDA tools, ORCAD Capture CIS, Cadence ORCAD Layout, Cadence Allegro, Mentor PADS

Location: Taoyuan
Our Company is a rapidly expanding technology company developing innovative cloud and device solutions across a wide range of cutting-edge technologies that provide a unified, connected service to millions of residential and commercial properties in the US and abroad. We are looking for a talented and passionate video embedded software engineer for the Device Engineering team to help us define the future of intelligent video surveillance and security by creating and integrating camera devices that connect with our robust cloud using advanced streaming technologies and multimedia processing. You will be working with a team of talented engineers across a diverse set of technological backgrounds to design video camera systems, build and manufacture hardware, architect and implement multimedia software stacks, and collaborate in an agile and fast-paced environment.
 
Required Skills:

• Bachelor's Degree in Computer Science, Electrical/Computer Engineering, or equivalent experience
• 3-5 years of embedded software development experience with Linux platforms
• Strong proficiency in C/C++ and Python programming
• Experience with multimedia frameworks and libraries (GStreamer, FFmpeg, DirectX, or OpenGL)
• Knowledge of video codecs (H.264, VP8/VP9), audio codecs (G711, G722), and streaming protocols
• Hands-on experience with camera pipelines, ISP integration, and video/audio processing algorithms
• Experience with embedded Linux or Android systems and Git version control

• Design and develop embedded software for Linux-based video camera devices with focus on SoC integration and hardware optimization
• Integrate video System-on-Chip components including camera sensors, ISPs, and hardware encoders to optimize the complete streaming pipeline
• Implement and optimize streaming protocols, codecs, and real-time video processing for reliable cloud transmission
• Collaborate with hardware engineers on camera performance optimization, power management, and hardware driver integration
• Work with cloud software teams to design APIs, protocols, and features that enable seamless device-to-cloud connectivity
• Partner with product managers and quality engineers to define technical requirements, conduct system testing, and ensure products meet performance and reliability standards

Location: Taipei

Responsibilities:
The Server BMC Firmware Engineer is expected to perform the following tasks.
* Troubleshooting issues during the development and manufacturing stage.
* Develop features in system level features on the Server BMC.
* Co-work with worldwide developers including QA, software engineers, support engineers.
* The candidate will be working on UISP products series

Requirements:
* PhD or MS in Computer Science or Electrical Engineering
* Strong knowledge of operating system internals, C/C++ language, object-oriented design, as well as strong C/C++ debugging skills on embedded-systems
* Excellent knowledge/experience in Linux kernel, Linux application development
* Excellent knowledge/experience in server BMC and OpenBMC Linux distribution
* Knowledge/experience in x86 architecture and arm architecture
* Knowledge/experience in GIT, JIRA, and Confluence tools for CI/CD
* Knowledge/experience in networking concepts (eg. NAT, VPN, VLAN, stp, igmp, lldp, QoS, DHCP, PPPoE)
* Team player. Can work independently
 
 

Location: Taipei
Responsibilities

• Develop UEFI BIOS solutions for server and/or desktop platforms, ensuring functionality aligns with product requirements.
• Design, implement, debug, and validate firmware, software, and hardware components across the system development lifecycle.
• Collaborate with cross-functional teams to provide engineering support and resolve BIOS-related issues effectively.
• Review and verify BIOS system specifications to ensure compliance with design and performance standards.
• Manage project schedules from initial design through to production release, ensuring on-time delivery.
• Conduct functionality and reliability testing to maintain high product quality and adherence to standards.
• Contribute to Linux kernel development, including custom device driver implementation and optimization.
• Consult and coordinate with multidisciplinary engineering teams to review and refine system specifications and functional requirements.
• Guide firmware, hardware, and QA teams to ensure timely and successful product integration and market readiness.

• Bachelor’s degree in Computer Science, Computer Engineering, or Electrical Engineering.
• 3+ years of experience in low-level software development, with a strong preference for candidates experienced in Legacy BIOS or UEFI firmware development.
• Proficient in C, C++, and/or Assembly; strong software design background is a plus.
• Solid understanding of PC hardware architecture, BIOS, and Linux-based systems.
• Demonstrated ability to work independently, take initiative, and manage tasks with minimal supervision.
• Proven team player with a strong passion for software development.
• Excellent communication and collaboration skills.

工作條件
1. Responsible for BIOS server project and co-work with other function team for motherboard porting.
2. Develop x86 BIOS feature, including RAS, redfish, IPMI, … etc, according to customer request.
3. Coordinate with EE/vendor to narrow down problems, provide root cause, and patch for BIOS issues.
4. Study and develop new technical knowledge, participate BIOS design, and write related guide.

具備條件

經驗與背景要求                        
1.產業經驗: a.製造業                        
                     b.資訊業                          
2.專業背景: a.跨地區企業級系統架構設計經驗           
                     b.了解企業級網路與系統硬體架構            
                     c.分散式大數據架構規劃能力                      
3.核心能力: a.IT系統與數據整合與規劃能力               
                     b.熟悉IT軟硬體底層運作機制與整合      
                     c.系統化分析與解決問題能力                      
4.主管經驗: a.團隊管理3年以上經驗                                                                   
5. 人格特質:a.負責任                        
                     b.善溝通協調                          
                     c.規劃能力佳                           
6. 語言能力:a.英文能力聽說讀寫佳                                                

 臺資科技上市公司
 薪資優渥，福利良好
【工作內容】
 1. 產品系統與互聯網資訊應用服務，領導團隊進行軟體專案開發、測試、驗證與上線
 2. 了解市場需求，思考合適之解決方案，協助產品之發展與應用
 3. 團隊領導與跨部門溝通協調
【工作能力需求】 
1. 擅長工具：Java, JavaScript, Python and SQL
 2. 具備團隊合作經驗與專案管理能力 
3. 勇於挑戰，具創新思考與商品化思維

Product ：consumer electronic Video/Audio solutions
Description：

• Firmware development on Microcontroller platforms with respect to functionality, performance and quality.
• Design, implementation, and verification of EE/FW components required for new product concepts, prototype, and product development
• Develop and integrate test frameworks into existing firmware and BSP
• System level debugging, efforts to improve performance and reliability.
• Support FW development tools, source code revision, configuration, and release management tools.
• Write technical specifications, perform end-to-end integration, root cause, and resolve system-level performance and reliability issues.

• 7+ years of proficiency in MCU firmware Coding
• Proficient in reading basic schematics and layouts
• Experience in working with Microprocessors/Controllers (STM, NXP, Cypress, Dialog, Ti, NVDIA) .
• Good Understanding of Audio/Video Technologies would be a plus.
• Experience working with multi-core processors shared memory and peripheral control.
• Good understanding of GPIO, peripherals, I2C, SPI, UART, USB, DMA connected devices
• Solid programming experience in C or C++ .
• Some scripting languages expertise in Python is preferred
• Extensive debugging skills, should have used JTAG, debuggers, USB analyzers
• Ability to mentor and lead junior level engineers in design and implementation. 
• Experience in using Source Control / Project Tracking systems (Github, Jira)
• Experience in USB protocol, Bluetooth or any Wireless protocol would be a plus.
• Hands-on experience in operating system such as Windows, Linux, RTOS

1. 前沿技術研發與指導：帶領團隊進行 AI 模型研發，深入探討並實作包含電腦視覺（Vision）、視覺語言模型（VLM）、視覺-語言-動作模型（VLA）等前沿技術。
2. 技術架構與決策：負責 AI 演算法的架構設計、訓練策略優化，並引導團隊進行技術選型與可行性評估（PoC）。
3. 研發團隊管理：指導並培育工程師，提升團隊程式碼品質、研發效率，建立良好的技術分享文化。
4. 技術落地與應用擴展：除了深化 Robotic AI 的應用（如具身智能、模擬環境與實體部署），亦需評估如何將現有 AI 技術遷移、擴展至其他具潛力的應用場景。

Computer Vision：物體偵測、語意分割、3D 視覺等。
VLM / LLM：多模態大模型微調、Prompt Engineering、RAG。
VLA / Embodied AI：端到端（End-to-End）控制、強化學習、模仿學習。

Responsibilities 

• Collaborate with other professionals to determine functional and non-functional requirements for software or applications. 
• Providing the engineers with architectural blueprints to follow. 
• Guiding and assisting the development team throughout the process. 
• Provide technical guidance and coaching to engineers. 
• Ensure software security and actively monitor the sharing of private information. 
• Looking for problems within software systems and resolving the issues. 
• Locating and directing solutions for critical challenges. 

具體條件
• 6+ years of experience designing system architecture and implementing software applications. 
• Familiar with common programming languages such as JavaScript/TypeScript, python 
• Experience working on cloud and hybrid-cloud software services. 
• Experience working on database systems including PostgreSQL, MongoDB and Redis. 
• Experience working on platforms including Kubernetes, Rancher and more. 
• Extensive experience in software development and project management. 
• Strong soft skills, including attention to detail, problem-solving and communication skills. 
• Clear logic thinking and good presentation skills. 

1.  L11 rack level server Thermal design & validation. 
2.  L11 & L12 thermal part qualification. .

lead team to do 
1. Server platform & infrastructure thermal developement 
2. Reliver thermal design deliverables
3. Review thermal test data and prepare report
4. Cross-function team co-work and support
5. Thermal related issues analyze and solve
6. Communicate with thermal  counterpart 
7. Join team database build-up 

 

1. 計劃與策略
• 制定專案的短期和長期目標，並設計達成目標的策略。
• 根據部門目標調整部門計劃，確保與公司方向一致。
2. 團隊管理
• 組建和領導團隊，確保部門成員協同工作。
• 提供指導和支持，協助員工完成工作目標。
• 執行績效評估，激勵和發展員工潛力。
3. 資源分配
• 確保人員、時間和預算等資源有效分配。
• 決定項目優先級，確保高效運作。
4. 溝通與協調
• 作為部門與其他部門或客戶之間的溝通橋樑。
• 定期匯報部門進展，確保資訊透明。
5. 問題解決
• 識別並解決專案執行中的重要問題。
• 預防和處理可能影響業務的風險。

Responsibilities

• Mainly focus on packaging design until mass production.
• Create packaging drawing / structure / concept.
• Develop new material / finish / process / UX improvement.
• Sample / DFM / SOP review.
• Internal - Work closely with the ID / ME / PM / Graphic team.
• External - Work closely with CMs / Suppliers.

• Logical thinking / Proactive personality.
• Effective communication and time management skills.
• 3+ years of experience in development of packaging structure design.
• Experienced using 2D: AutoCAD / Illustrator.
• Experienced using 3D: Rhino or Solidworks or ProE / Keyshot.
• Knowledge of material processing for pulp tray, cardboard, blister, gift box, carton and all types of printing processes.
• Knowledge of a wide variety of packaging styles, type and material.
• Knowledge of reliability tests.

1. Mechanical Design
2. Project Management
3. Issue Analysis and Solution Capability
4. Cross Function Communication

工作職掌:
1. CAD 設計3D/2D by UG
2. Design review and analysis
3. DFM review and discussion with vendor
4. Design improvement proposal
5. DOE planning and report
6. Tracking and FA for PD issue of NPI build

專業相關: 
1.有Server產品ODM/品牌廠機構設計經驗3年以上。(一面前需附上個人作品集)
2.熟悉6-sigma,GD&T,公差分析概念，熟悉UG繪圖軟體與JMP分析軟體佳。
3.熟悉機械加工工藝與DFMreview.對於鈑金、射出成形、CNC、金屬表面處理等知識。
4.英文聽說讀寫能力順暢，可以獨立與美系客戶溝通及合作。
5.習慣團隊工作模式、擅長溝通以及能夠有效快速的傳授知識技能與新進人員。


 

Job Responsibilities 
-         Conduct mechanical feasibility study from initial ID concepts through sizing analysis, component selection, refinement of design details, assembly and integration, and performance/environment qualification testing 
-         Search out materials, components. Create detailed 3D CAD models, 2D drawing and BOM for the product. 
-         Perform thermal, structural testing and analysis to predict and optimize the system performance 
-         Build prototypes, analyze results of reliability testing, improve the design and bring to production. 
-         Develop component and assembly drawings and specifications, tolerances for production 
-         With EV-charger product design/MP experiences. Can lead from ID structure to Mass production. 
-         With a good thermal sense and can apply thermal solutions in the initial stage. And co-work with the thermal team to optimize design. 
-         Familiar high tension distributor design (cable route in EV-charger DC) 
-         Familiar safety and reliability of Ev-charger. 
-         With Outdoor IPX6 product design/MP experiences, familiar test and verification in MP. 
 

1. Define and drive overall product strategy and roadmap for Data Center, AI Server, and Standard Rack Server platforms, ensuring strong market competitiveness and long-term business growth.
2. Align product positioning, specifications, and differentiation with market trends, customer needs (CSP Tier 1/2/3, enterprise, and AI customers), and emerging technologies.
3. Lead cross-functional collaboration across R&D, sales, and supply chain to ensure seamless product execution, high quality, and on-time delivery (TTM).
4. Partner with key vendors, ODM/OEMs, and ISV/SI ecosystem players to expand business opportunities and strengthen product competitiveness.
5. Support sales teams and key customers by delivering strategic insights, product positioning, and executive-level presentations to drive alignment and adoption.
6. Lead and mentor the product management team, fostering strong ownership, execution capability, and cross-functional alignment.

1. 8+ years of experience in server, data center, or enterprise hardware product management.
2. Hands-on experience with rack server, AI server, GPU server platforms, or within the ODM/OEM server ecosystem.
3. Strong strategic thinking with the ability to define product roadmap and translate it into execution.
4. Proven ability to manage complex projects, drive results, and meet business and product goals.
5. Excellent leadership and stakeholder management skills, with the ability to align cross-functional and external partners.
6. Proactive, adaptable, and goal-oriented mindset.
7. Strong presentation and communication skills in English, with experience engaging vendors, sales teams, and key customers effectively.

工作內容（Responsibilities）
•  負責產品的開發策略（Product Launch Plan）規劃與整體市場分析與洞察，包含市場趨勢、競爭者分析、客戶需求與產業動態
•  與產品、業務、營運等跨部門合作，依據客戶導入情境，設計並優化 B2B / Solution-based 商業模式（如專案制、
    訂閱制、模組化銷售）與 Go-To-Market 策略。
•  定義並持續優化 產品定位（Positioning）與價值主張（Value Proposition），確保產品在目標市場中具備清楚
    且具競爭力的差異化
•  規劃並執行NPI產品生產，包含研發問題解決、工廠制造生產、產品Cost BOM、PoC試產計劃。
•  蒐集並分析市場與客戶回饋，將洞察轉化為具體建議，回饋至產品開發與商業決策
•  追蹤與分析產品行銷成效指標（KPI），持續優化行銷與產品策略

•  10 年以上 Product Marketing、產品管理、策略顧問或相關經驗
•  具備扎實的 市場分析、競爭分析與商業策略規劃能力
•  熟悉產品定位、品牌訊息架構與 Go-To-Market 流程
•  具備垂直產業系統導入經驗為最佳
•  熟悉 B2B 銷售流程與長決策週期，能理解多方利害關係人的需求
•  能獨立進行策略思考，同時具備良好的跨部門溝通與協作能力
•  具備數據分析能力，能以數據支持策略決策
•  醫療場域與法規知識：熟悉醫院作業流程 & 瞭解醫療器材與自動化設備之法規驗證
•  機器人與自動化技術領域知識：具備 AMR 系統設計架構、感測器整合及系統串接（HIS/NIS 醫院資訊系統）之專業知識與對話能力。
• 專案管理與場域落地實務：具備 PMP、PoC（概念驗證）設計、Site Survey、跨系統整合測試及場域上線營運（Deployment）之實務經驗。
•  跨領域溝通：能有效地與外部機器人系統整合商（SI）進行跨領域溝通

負責機器人／Physical AI 產品之市場與產品定義，整合客戶需求、競爭情報與關鍵技術夥伴 Roadmap，制定產品定位、規格與 Product Roadmap。

1. 分析市場趨勢、客戶需求與競品，定義目標市場、產品定位、核心規格及 Product Roadmap。
2. 主導新產品規劃與需求定義，規劃產品之 Positioning、Pricing、Promotion、Channel 等市場策略，並蒐集 Voice of Customer 持續優化產品。
3. 擔任 NVIDIA 等關鍵技術夥伴之主要產品窗口，掌握平台／技術 Roadmap，評估新技術與新平台導入機會。
4. 管理 IPC、LiDAR、Motor／Servo、Sensor 等 Key Supplier，掌握技術趨勢、產品生命週期、供應風險與替代方案。
5. 協同研發、業務、行銷及供應鏈，推動產品導入、市場應用與客戶解決方案。

1. 必備條件（Must-have Qualifications）
• 自動化或相關科技產品之產品管理經驗。
• 熟悉市場分析、產品定位、競品分析、MRD／PRD、Product Roadmap 與產品生命週期管理。
• 能理解機器人系統架構及 Physical AI 。
• 具跨研發、業務、行銷、採購與供應鏈協作能力，能將市場需求轉化為產品規格與方案。
2. 加分條件（Preferred Qualifications）
• 具機器人、AI／Edge AI、智慧硬體、
• 具 NVIDIA 或其他關鍵平台／技術供應商之合作、Roadmap Review 或新技術導入經驗者佳。

理工、資訊、電機、機械、自動化或相關科系大學以上。

1.Plan and monitor new product development schedules on BOM structure, material, manufacturing planning, and sample delivery. 
2.Coordinating cross-functional resources to ensure on-time project execution.
3.Manage material readiness, including procurement, allocation of testing materials, and communication with customers and suppliers on supply schedules.
4.Coordinate and control BOM (Bill of Materials) creation, release, and change management to ensure structural accuracy and timely updates.
5.Oversee prototype management and recovery of R&D materials at each stage to support smooth mass production transition.
6.Tasks assigned by the supervisor.

管理幅度：需有至少 10 人以上管理經驗。
工作模式：前 3–6 個月與現任 PM Head 共事，熟悉流程後獨立帶領 1 個 Division。

1. Lead and manage NPI project from project kick-off to MP sustaining
2. Lead and facilitate internal/external discussions until closed
3. Able to reach objectively good negotiation result, maintain good relationship with internal and external stakeholders
4. Proactively solves problems with functional teams
5. Proactively solves potential problems with functional teams, avoids unnecessary conflicts
6. Able to set the priorities for the multiple tasks and meet or exceed customers’ expectations

工作內容：
1. 規劃軟體架構，評估 ROI，執行控管軟體開發，深化 BU 產品的附加優勢
    a. 規劃與執行 解決方案 (Market Ready Solution)
    b. 規劃與執行 IoT edge device 的跨平臺的軟體框架，並導入到產品
    c. 規劃與執行 雲服務 (SaaS)，並導入到客戶方案
2. 分析客戶需求，控管軟體規格，評估時程與投入資源，確保軟體開案 ROI
3. 制定與迭代  軟體細節規格，包含 solution, Middleware (Utility, API, services), cloud services
4. 與策略 雲服務夥伴 (Cloud Service Provider)，研擬合作方案，深化合作關系
5. 評估 ISV (Independent Software Vendor) 與 AI 技術廠商，提升合作層次，擴大生態圈夥伴
6. 軟體專案管理，計畫排定任務的優先順序，確保交付時程與軟體品質

具備條件

工作內容
Product Roadmap & Portfolio ownership
1.     Market trend and Competitor analysis
2.     Product features definition
3.     Push for Time to Market in technology/architecture transition
4.     Identify product roadmaps gaps and engage with WW development teams to deliver roadmap requirements
5.     Support product pitch, demos and training to markets / partners

工作內容
1.由「BU」的角度思考，做好縱向與橫向單位間溝通，爭取資源、制訂前瞻策略與發展團隊於長遠規劃上。
2.協調分配資源，根據組織的需求變化快速調整人力及協調各種資源，確保關鍵資源最佳化，重要目標的進度符合預期。
3.承上啟下，將BU目標轉換成部門目標，規劃部門短、中、長期發展，讓同仁清楚明確的目標方向和量化的里程碑，並規劃可執行的方案
管理部門運作，建立統一的營運管理方針政策，對部門日常進行指導、指揮、監督、管理，並承擔執行各項上級指示的任務
4.瞭解組織內的工作項目與流程，體會工作細節的效率。讓同仁共同將瑣碎的事情透過建立SOP和系統化...等有效的方法管理，提升整體的營運效率
5.創新產品和商務模式，顛覆產業，創造客戶價值
6.挖掘商務合作和業務機會。

具備條件
產品線/區域：機器人、智慧教育、智慧醫療
其他條件
- 物聯網、人工智慧應用、機器人、教育類創新產品...等產品
- 電子業、軟硬體整合商、創投
- BD、PM、商務策略管理顧問
- 主管10年以上經驗

 

職缺條件
1. 具8-10年以上經驗電子產品開發專案管理
2. 具3年以上伺服器產品開發經驗
3. 具3年以上團隊領導經驗

 

1. 熟悉ISO13485品質系統與認證流程
2. 熟悉ISO14971風險管理系統
3. 能引領並指導團隊在各階段產出符合ISO13485 / ISO14971要求之文件資料
4. 能主導並跟進團隊完成風險管理及相關證確效之細項工作
5. 執行內部定期稽核與系統維護

帶領團隊進行光達及其他精密光機電產品之相關車用品質系統之規畫、建立、執行、取得認證，包含 IATF 16949、VDA 6.3、VDA 6.5、ISO26262、ISO 21434、ISO 21448等相關品質系統

SMT製程優化、PCBA FA、DFM分析

學歷大學以上，電子工程/工業工程/自動化相關
經驗 SMT管理10年以上，含3年以上中大型廠經驗
專業熟悉SMT、DIP全製程，有自動化導入經驗佳

工作內容：
1. SMT
2. 新產品導入
3. PCBA
崗位職責：
1. 負責對公司SMT產品的技術研發和投資方案的制定;
2. 負責分析市場動態，提出SMT產品技術發展趨勢;
3. 制定並管理SMT產品的研發計劃，監督計劃實施;
4. 根據市場需求和客戶需求，優化產品結構，提供有效的產品方案;
5. 負責技術裝備的投資安排，確保設備的正常維護和管理;
6. 組織SMT產品的質量檢測，並監督生產品質的管理;
7. 負責協調資源，確保SMT產品的正常研發、生產和品質控制;
8. 按照公司要求完成其他相關任務; 
任職要求：
1. 工作經驗：12年+ PCBA行業工程DFM/DFA相關工作經驗
2. 管理經驗：5年+專案專案執行管理或生產統籌經驗
3. 工作技能：
• 10年+ SMA DFM相關製程管理及異常處理經驗，熟練使用Minitab，DOE，SPC，FEMA，6 Sigma等製程分析工具
• 5年+新產品新製程/新技術導入經驗或自動化設備開發驗證經驗
• 有新產品小量試做 到大量生產經驗
• 個人特質：有企圖心、責任感、上進心、邏輯思維能力強，具有創新意識及良好的溝通協調能力
• 英語能力：聽/說/讀/寫流利

1.熟自動化設計結構與生產製造流程改善
2.熟機構設計、加工和自動化組裝
3.具機械手臂及影像判別實作經驗
4.生產設備自動化提升改善
5.自動化設計結構與生產製造流程改善

SMT、DIP設備管理; SMT 置件程式、AOI檢測程式製作管理

1.規劃新產品的測試/設備/方法/治工具/移交量產線
2.產品驗證並完成測試計畫與測試報告
3.製作測試治具及撰寫測試程式&與檔案資料庫管理及測試SOP
4.規畫/評估/驗證/追蹤新產品
5.執行開發技術專案
6.評估及驗證工程設計/工廠製程變更
7.驗證及確認TE測試項目。
8.分析產品試作及量產線問題對策
9.單位領導管理

管理職

工作職掌：
1.設備採購團隊管理
2.採購商務談判及成本分析
3.Cost saving及提升服務水平
4.供應商開發管理

基本條件需求：
1.熟悉採購作業流程，設備廠商資源豐富
2.採購談判、降本技巧、分析判斷力強
3.團隊管理及跨部門協作溝通能力強
4.英語口語表達流利

基本條件需求：採購供應鏈/工程/國際貿易/機電優先
 

工作職掌：
1.主動元件採購降低總成本，側重在 EV採購
2.關鍵物料包產能與保供應、Early   project involement
3.BOM結構優化、成本分析管理
4.供應商開發及管理


 

管理職

工作職掌
1.電池材料與設備採購策略制定與執行
2.優化BOM結構、推薦2nd source及 Cost Saving
3.關鍵物料包產能與保供應
4.供應商開發及管理、季度績效檢討

需具備專業：
1.熟悉電池材料與設備採購作業流程
2.具備新能源電池產業相關經驗
3.具管理經驗(至少帶領過5-10人的團隊)
4.責任心強，善於溝通協調，英語流利

基本條件需求
採購供應鏈/工程/國際貿易/機電優先

工作內容：
 1.策略採購(sourcing)
　　1.1 負責EV充電樁材料項目。
　　1.2 詢比議價, , 專案BOM cost審查, 相關內部資料維護。
　　1.3 執行供應商管理, 執行採購策略, 掌握供應鏈市場訊息。
　　1.4 對接研發部門, 新規選型, 材料成本優化…..等相關前期採購作業。
 
2.供應商管理與開發
　　2.1 強化關鍵供應商策略合作關係, 定期business review。
　　2.2 持續開發具競爭力供應商, 供應鏈汰弱留強。


3.其他事務
　　3.1 集團內跨廠區、跨部門協同合作。

 

(1)負責事業單位之財務策略規劃與經營分析，作為BU Head的財務策略夥伴
(2)協助建立及控管年度目標、月滾動預測，追蹤營運績效，協助BU達成營收與獲利目標
(3)作為BU與各部門之橋樑，協調資源、流程與政策執行。
(4)支援BU營運關鍵專案（如新產品導入、跨國併購、供應鏈移轉）之財務面分析與追蹤
(5)支援ERP系統改善、數據自動化與數位財務轉型等相關專案

(1)大學以上會計、財務、商管相關科系畢業
(2)熟悉財務報表編製、預算與成本控制流程
(3)能獨立完成財務分析、提供經營建議與行動方案
(4)熟悉Excel
(5)良好的溝通能力與跨部門合作經驗，具備數據導向與商業敏感度
(6)具備良好英文能力，能與海外團隊溝通協作
 

R&R:
1. Execute budget/actual financial performance review (incl. MoM, YoY) on P&L, CapEx, and related key drivers 
2. Provide management reporting with business insights, including potential opportunities to improve profitability and early warnings on future deviations.
3. Act as a business partner with customer PBUs / functional platforms to drive initiatives and recommend changes for process improvements.
4.  Work on new business development assessment through early involvement and proactive engagement as well as cross-functional team collaboration
5. Act as an FP&A representative to various high priority projects to ensure financial soundness
6. Take in-charge for Ad-Hoc analysis
 

 

公司性質：台灣知名上市大集團
工作內容： 
   1. 合約風險把關 
   2. 法務工作領導及團隊管理
   3. 跨國及跨單位事務溝通及協調 
   4. 總部角度出發之各區工作協作
   5. 專案指導及/或主導，專案含法遵、訴訟、勞資爭議等
   6. 主管指派事務協作及/或處理 
 

公司性質：上市電子科技業 
工作內容： 
1.公司銀行額度管理與維繫 
2.公司及海外子公司資金調度與外匯避險 
3.上市櫃公司財務資訊公告及財務相關工作經驗 
4.聯貸及公司資金籌措規劃